837 Series

cardEDGE+

Features

  • 0.156" (3.96mm) Contact Spacing by 0.200" (5.08mm) Row Spacing
  • Accepts .062" (1.57mm) Nominal Thickness P.C. Board
  • High Profile Insulator Body, .600" (15.24mm)
  • Card Slot Depth of .330" (8.38mm)
  • Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bends
  • Single or Dual Row Configurations
  • Large Variety of Mounting Options, Flush or Offset Lugs
  • Accepts between Contact and In-Contact Polarizing Keys
  • Pre-assembled Card Guides are available
  • RoHS Compliant, UL Certified
 

Specifications

  • Insulator Material: (837: Diallyl Phthalate 887: Polyphenylene sulfide) , UL 94V-0
  • Contact Material: Copper Alloy
  • Contact Plating: Gold Plating on mating area and Tin Plating on tails with Nickel underplating all over
  • Current Rating: 3 Ampere
  • Contact Resistance: 10 milliohms maximum
  • Dielectric Withstand Voltage: 1800V AC rms at sea level between adjacent contacts
  • Insulation Resistance: 5000 Megaohms minimum
  • Operating Temperature: -40°C to +125°C
  • 16oz (4.45N) maximum per contact pair when tested with .070" (1.78mm) thick gauge
  • Withdrawal Force: 1oz (0.28N) minimum per contact pair when tested with .054" (1.37mm) thick gauge

 

Notes

Ordering Guide:

 
837
 
EDAC Card Edge Connectors
EDAC Card Edge Connectors
EDAC Custom Connectors | Card Edge
EDAC Custom Connectors | Card Edge
EDAC Card Edge Connector | Wire Wrap Terminals
EDAC Card Edge Connector | Wire Wrap Terminals
EDAC Card Edge Connector | Wire Hole Terminals
EDAC Card Edge Connector | Wire Hole Terminals
EDAC Custom Interconnect Solutions
EDAC Custom Interconnect Solutions

High Temp Card Edge Connector | Green | 0.156" (3.96mm) Pitch | 0.200" (5.08mm) Row Spacing | High Profile Insulator


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