Features
- Low Profile for Space Saving
- Insertion Loss: Differential Pair Signaling 19 Gbps @ -3 dB
- Available in 100 and 150 contacts
- Available in Vertical SMT and Right Angle SMT
- PCIe 3.0 Compliant
- Application: Server, Data Storage
Specifications
- Housing Material: High Temperature Thermoplastic UL-94V-0
- Contact Material: Copper Alloy
- Soldering: Copper Alloy
- Contact Plating: Gold Flash Plating
- Voltage Rating: 200 V AC
- Current Rating: 1.4 A
- Contact Resistance: 25 m? Maximum
- Dielectric Withstand Voltage: 200 V AC for 60 seconds
- Insulation Resistance: 10000 M? Minimum
- -55°C to +125°C
- Mating Force: 0.52 N/Pin Maximum
- Unmating Force: 0.09 N/Pin Minimum
Notes
Board to Board 0.8 mm Pitch
Part # |
Position |
Gender |
Material |
Color |
Type |
2D PDF |
3D STEP |
|
|---|---|---|---|---|---|---|---|---|
|
472-100-529-001 | 100 | Male | High Temperature Thermoplastic UL-94V-0 | Black | Vertical SMT | ||
|
|
472-150-529-001 | 150 | Male | High Temperature Thermoplastic UL-94V-0 | Black | Vertical SMT |
