470 Series



  • Board to Board Type
  • High Density for Space Saving
  • Soldering Charge Design to Prevent unwetting
  • Insertion Loss: Differential pair signaling 18 Gbps @ -3 dB
  • Available in 100 contacts and 160 contacts
  • Application: Server, Data Storage


  • Housing Material: High Temperature Thermoplastic UL-94V-0
  • Contact Material: Copper Alloy
  • Soldering Charge: Tin Alloy
  • Contact Plating: Gold Flash Plating
  • Voltage Rating: 150 V AC
  • Current Rating: 2.9 A/ Pin
  • Contact Resistance: Initial: 10 m? Maximum, After Test: rR 5 m?
  • Dielectric Withstand Voltage: 900 V AC for 60 seconds
  • Insulation Resistance: 25000 M? Minimum
  • -20°C to +105°C
  • Mating Force: 0.4 N/Pin Maximum
  • Unmating Force: 0.1 N/Pin Minimum



Ordering Guide:


High Speed Card Edge Connectors | Board to Board Male Vertical SMT Connector 1.27mm Pitch


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