Features
- Board to Board Type
- High Density for Space Saving
- Soldering Charge Design to Prevent unwetting
- Insertion Loss: Differential pair signaling 18 Gbps @ -3 dB
- Available in 100 contacts and 160 contacts
- Application: Server, Data Storage
Specifications
- Housing Material: High Temperature Thermoplastic UL-94V-0
- Contact Material: Copper Alloy
- Soldering Charge: Tin Alloy
- Contact Plating: Gold Flash Plating
- Voltage Rating: 150 V AC
- Current Rating: 2.9 A/ Pin
- Contact Resistance: Initial: 10 m? Maximum, After Test: rR 5 m?
- Dielectric Withstand Voltage: 900 V AC for 60 seconds
- Insulation Resistance: 25000 M? Minimum
- -20°C to +105°C
- Mating Force: 0.4 N/Pin Maximum
- Unmating Force: 0.1 N/Pin Minimum
Notes
Board to Board Male Vertical SMT Connector 1.27mm Pitch
Part # |
Position |
Insulator Height |
Material |
Color |
Datasheet |
3D Model |
|
|---|---|---|---|---|---|---|---|
|
|
470-100-529-001 | 100 | 6.61mm | High Temperature Thermoplastic UL-94V-0 | Black | ||
|
470-160-529-001 | 160 | 7.71mm | High Temperature Thermoplastic UL-94V-0 | Black |
