470 Series

Features

• Board to Board Type
• High Density for Space Saving
• Soldering Charge Design to Prevent unwetting
• Insertion Loss: Differential pair signaling 18 Gbps @ -3 dB
• Available in 100 contacts and 160 contacts
• Application: Server, Data Storage

Specifications

• Housing Material: High Temperature Thermoplastic UL-94V-0
• Contact Material: Copper Alloy
• Soldering Charge: Tin Alloy
• Contact Plating: Gold Flash Plating
• Voltage Rating: 150 V AC
• Current Rating: 2.9 A/ Pin
• Contact Resistance: Initial: 10 m? Maximum, After Test: rR 5 m?
• Dielectric Withstand Voltage: 900 V AC for 60 seconds
• Insulation Resistance: 25000 M? Minimum
• -20°C to +105°C
• Mating Force: 0.4 N/Pin Maximum
• Unmating Force: 0.1 N/Pin Minimum

Notes