421 Series

Features

• .200" (5.08mm) Contact Spacing x .300" (7.62mm) Row Spacing with staggered Grid
• Mount into .062" (1.57mm) or .093" (2.36mm) Nominal Thickness P.C. Board by Soldering and/or Staking of P.C. Tails
• Edacon Hermaphroditic Contact Mating Design
• Mounting Hole and Guide Pin Options
• 421 Series Designed to mate with Non-Card Guide Versions of 408 or 415 Series, 422 Series, 438 Series Designed to mate with Card Guide Versions of 408 or 415 Series, 423 Series Designed to mate with 424 or 438 Series
• RoHS Compliant

Specifications

• Insulator Material: UL 94V-0 Diallyl Phthalate, Green Color
• Contact Material: Copper Alloy
• Contact Plating: Gold Plating over Nickel over entire contact
• Current Rating: 10A Continuous
• Contact Resistance: 10 milliohms maximum
• Dielectric Withstanding Voltage: 2000 VAC rms at sea level
• Insulation Resistance: 5000 Megaohms minimum
• Operating Temperature: -65°C to +125°C
• Insertion Force: 2 to 16 Oz (0.56 to 4.45N) per contact position
• Withdrawal Force: 2 to 16 Oz (0.56 to 4.45N) per contact position

Notes