Features
- For IBM-AT Industry Standard Architecture
- .100" (2.54mm) Contact Spacing x .200" (5.08mm) Row Spacing
- Accepts .062" (1.57mm) Nominal Thickness P.C. Board
- High Profile Insulator Body, .600" (15.24mm) Divided in Groups of 62 and 36 Contacts
- Contact Termination Options include P.C. Tail, Wire Wrap, 90 Degree and Extender Board Bends
- Automatic Wire Wrap Positioning Holes
- Accepts between Contact and In-Contact Polarizing Keys
- RoHS Compliant & UL Certified
Specifications
- Insulator Material: UL 94V-0 Thermoplastic Polyester, Black Color
- Contact Material: Copper Alloy
- Contact Plating: Gold Plating on mating area and Tin Plating on tails with Nickel underplating all over
- Current Rating: 3 Amperes
- Contact Resistance: 10 milliohms maximum
- Dielectric Withstand Voltage: 1200 VAC rms at sea level between adjacent contacts
- Insulation Resistance: 5000 Megaohms minimum
- Operating Temperature: -40°C to +105°C
- Insertion Force: 16oz (4.45N) maximum per contact pair when tested with .070" (1.78mm) thick gauge
- Withdrawal Force: 1oz (0.28N) minimum per contact pair when tested with .054" (1.37mm) thick gauge
Notes
EDAC Card Edge Connectors
EDAC Custom Connectors | Card Edge
EDAC Card Edge Connector | Wire Wrap Terminals
EDAC Card Edge Connector | Wire Hole Terminals
EDAC Custom Interconnect Solutions
