370 Series

Features

  • High Density for Space Saving
  • Insertion Loss: Differential Pair Signaling 21 Gbps @ -3 dB
  • Available in 20, 100, 180, and 200 contacts
  • Height: 7.8 mm
  • SAS 3.0 & PCIe Compliant
  • Application: IPC, Server, Data Storage
 

Specifications

  • Housing Material: High Temperature Thermoplastic UL-94V-0
  • Contact & Shield Material: Copper Alloy
  • Contact Plating: Gold Flash Plating
  • Current Rating: 3.1 A/ Pin
  • Contact Resistance: Initial: 15 m? Maximum, After Test: rR 5 m?
  • Dielectric Withstand Voltage: 750 V AC for 60 seconds
  • Insulation Resistance: 1000 M? Minimum
  • -55°C to +125°C
  • Mating Force: 0.63 N/Pair Maximum
  • Unmating Force: 0.06 N/Pair Minimum


 

Notes

Ordering Guide:

 
370
 

High Speed Card Edge Connectors | Card Edge Connector SMT 0.8mm Pitch | Receptacle without Latch


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