302 Series

Features

  • Accommodates MCA (Microchannel Architecture) Daughter Boards for IBM PS/2 Systems
  • .050" (1.27mm) Contact Spacing with Staggered Tail Bend Results in 4 Rows at .100" (2.54mm) Spacing
  • Accepts .062" (1.57mm) Nominal Thickness P.C. Board, Accurately Positioned by Card Slot Barrier
  • High Profile Insulator Body, .610" (15.49mm)
  • Mounting Posts Provide Positive Location and Retention
  • P.C. Tail Contact Termination
  • Many other sizes available. Contact EDAC for additional items
  • RoHS Compliant
 

Specifications

  • Insulator Material: UL 94V-0 Thermoplastic, Color: Brown
  • Contact Material: Copper Alloy
  • Contact Plating: Gold Plating on mating area and Tin Plating on tails with Nickel underplating all over
  • Current Rating: 1 Amperes
  • Contact Resistance: 30 milliohms maximum
  • Dielectric Withstand Voltage: 500 VAC rms at sea level between adjacent contacts
  • Insulation Resistance: 1000 Megaohms minimum
  • Operating Temperature: -40°C to +125°C
  • Insertion Force: 8oz (2.22N) maximum per contact pair when tested with .062" (1.57mm) thick gauge
  • Withdrawal Force: 1oz (0.28N) minimum per contact pair when tested with .062" (1.57mm) thick gauge

 

Notes

 
 
 
 

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