105 Series

Features

• 0.100" (2.54mm) or 0.200" (5.08mm) contact spacing for contacts on strip
• Other spacings accomodated with loose contacts
• Assemble into 0.062" (1.57mm) nominal thickness P.C. board by staking and/or soldering of contact tails
• Edacon hermaphroditic contact mating design
• Card guides, guide pins, guide sockets and polarizing sleeves to ensure correct alignment and mating design
• Handling and assembly simplified with contacts on strips
• Designed to mate with 100 series contacts in parallel or perpendicular board configurations
• RoHS Compliant

Specifications

• Contact Material: Copper Alloy
• Contact Plating: Gold plating over nickel for entire contact
• Current Rating: 5 or 10 amps (see ordering code notes)
• Contact Resistance: 10 milliohms maximum
• Insertion and Withdrawal Force: 2 to 16 oz (0.56 to 4.45 N) per contact

Notes