Features
- Top performance for high speed networking, voice, and data applications
- Meets FCC Part 68, Subpart F requirements
- Advanced EMI/RFI protection with grounding options (PCB or Panel)
- Available with or without EMI
- Applications: Telecommunications, consumer, energy, industrial, medical, process control, ruggedized, transportation
- RoHS Compliant
Specifications
- Housing Material: LCP or Nylon
- Contact Material: Phosphor Bronze
- Contact Plating: Gold plating on contact area and tin plating on tails with nickel underplating all over
- Current Rating: 1.5A @25°C
- Voltage Rating: 125V AC
- Contact Resistance: 20 m? maximum
- Dielectric Withstanding Voltage: 1000V AC
- Insulation Resistance: 500 M? minimum
- Durability: 750 cycles minimum
- Operating Temperature: -40°C to +85°C
- Wave Soldering Process: 260°C ± 5°C, 5~10 Seconds
Notes
EDAC Modular and Magnetic Jacks
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EDAC Custom Interconnect Solutions
