Features
- High Density for Space Saving
- Insertion Loss: Differential Pair Signaling 21 Gbps @ -3 dB
- Available in 20, 100, 180, and 200 contacts
- Height: 7.8 mm
- SAS 3.0 & PCIe Compliant
- Application: IPC, Server, Data Storage
Specifications
- Housing Material: High Temperature Thermoplastic UL-94V-0
- Contact & Shield Material: Copper Alloy
- Contact Plating: Gold Flash Plating
- Current Rating: 3.1 A/ Pin
- Contact Resistance: Initial: 15 m? Maximum, After Test: rR 5 m?
- Dielectric Withstand Voltage: 750 V AC for 60 seconds
- Insulation Resistance: 1000 M? Minimum
- -55°C to +125°C
- Mating Force: 0.63 N/Pair Maximum
- Unmating Force: 0.06 N/Pair Minimum
Notes
High Speed Card Edge Connectors | Card Edge Connector SMT 0.8mm Pitch | Receptacle with Latch
Loading Parts
Part # |
Position |
Material |
Color |
Datasheet |
3D Model |
|
|---|---|---|---|---|---|---|
|
|
371-100-529-002 | 100 | High Temperature Thermoplastic UL-94V-0 | Black | ||
|
371-180-529-002 | 180 | High Temperature Thermoplastic UL-94V-0 | Black |
