Board to Board Stacked (MINI 302) / Series 302 (.050

Series 302 (.050

FEATURES

  • Accommodates MCA (Microchannel Architecture) daughter boards for IBM PS/2 systems
  • .050 (1.27) contact spacing with staggered tail bend results in 4 rows at .100 (2.54) spacing
  • Accepts .062 (1.57) nominal thickness P.C. board, accurately positioned by card slot barrier 
  • High profile insulator body, .610 (15.49)
  • Mounting posts provide positive location and retention
  • P.C. tail contact termination
  • Many other sizes available.  Please contact Edac for additional items.

SPECIFICATIONS

  • Insulator Material: polyphenylene sulphide, UL 94V-0, color: Black
  • Contact Material: phosphor bronze
  • Contact Plating: gold on the mating area, tin on the contact tails, nickel underplate
  • Current Rating: 1 amperes continuous
  • Contact Resistance: 30 milliohms maximum
  • Dielectric Withstanding Voltage: 500 V AC rms @ sea level
  • Insulation Resistance: 1000 megohms minimum
  • Operating Temperature: -65 to +125 degrees C
  • Insertion Force: 8 oz (2.22 N) maximum per contact pair when tested with a .062 (1.57) thick gauge
  • Withdrawal Force: 1 oz (0.28 N) minimum per contact pair when tested with a .062 (1.57) thick gauge


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