Series 700

• Compliant pin ultra-mate press fit technology with make before break hot swap capability.
• Solderless field serviceable board contacts in 0.100, 0.125 and 0.156 spacing.
• Gold-over-nickel plated contacts with nickel underlay, in PCB thru-hole or wirewrap terminations.
• Optional MBB technology allows for hot swapping circuit boards using make-before-break contacts.
• From 5 to 150 pins (0.100), 5 to 120 pins (0.125) or 5 to 86 pins (0.156).
• Unique compliant pin design allows for low insertion force and no damage to boards.
• Also available in a press fit telecom ribbon connector style (Series B57 see Telecom Backplane Connector).